Low temperature poly-silicon tft substrate and manufacturing method thereof

ABSTRACT

The present invention provides a LTPS TFT substrate and a manufacturing method thereof. The LIPS TFT substrate of the present invention includes a metal layer formed on a channel zone so that the metal layer, a source electrode, and a drain electrode can be used as a mask to form LDD zones in a poly-silicon layer in order to save the mask needed for separately forming the LDD zones; further, due to the addition of the metal layer that is connected to the channel zone of the poly-silicon layer, the electrical resistance of the channel zone can be effectively reduced to increase a TFT on-state current. The LTPS TFT substrate manufacturing method of the present invention forms a metal layer on a channel zone at the same time of forming a source electrode and a drain electrode and uses the metal layer, the source electrode, and the drain electrode as a mask to form LDD zones in a poly-silicon layer so as to save the mask needed for separately forming the LDD zones thereby reducing the manufacturing cost and increasing throughput.

CROSS REFERENCE TO RELATED APPLICATIONS

This is a divisional application of co-pending U.S. patent applicationSer. No. 14/912,610, filed on Feb. 18, 2016, which is a national stageof PCT Application No. PCT/CN2016/072772, filed on Jan. 29, 2016,claiming foreign priority of Chinese Patent Application No.201510936669.6, filed on Dec. 14, 2015.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to the field of display technology, and inparticular to a low temperature poly-silicon (LTPS) thin-film transistor(TFT) substrate and a manufacturing method thereof.

2. The Related Arts

Liquid crystal displays (LCDs) have a variety of advantages, such asthin device body, low power consumption, and being free of radiation,and are thus of wide applications, such as mobile phones, personaldigital assistants (PDAs), digital cameras, computer monitors, andnotebook computer screens.

Most of the liquid crystal displays that are currently available in themarket are backlighting liquid crystal displays, which comprise anenclosure, a liquid crystal panel arranged in the enclosure, and abacklight module mounted in the enclosure. The structure of aconventional liquid crystal panel is made up of a color filter (CF)substrate, a thin-film transistor (TFT) array substrate, and a liquidcrystal layer arranged between the two substrates and the principle ofoperation is that a driving voltage is applied to the two glasssubstrates to control rotation of the liquid crystal molecules of theliquid crystal layer in order to refract out light emitting from thebacklight module to generate an image.

The LTPS technology is a manufacturing technique for a new generationTFT substrate. Compared to the traditional amorphous silicon (a-Si)technology, the LIPS displays have a faster response speed and showvarious advantages including high brightness, high resolution, and lowpower consumption. For the LTPS technology, the one that is mostcommonly used by most of the major manufacturers is the top gate LIPSTFT substrate. However, the top gate LTPS TFT substrate is oftenadditionally provided with a light-shielding metal layer on a bottom ofa TFT device located in an active area in order to prevent the influencecaused by a leakage current resulting from light irradiation. Thisincreases the manufacturing cost of the LTPS TFT substrates. Thisimplies the development of bottom gate LIPS TFT substrates would be ofsignificant meaning in the respect of saving cost and increasingthroughput.

Referring to FIG. 1, a cross-sectional view is given to illustrate thestructure of a conventional bottom gate LIPS TFT substrate, whichcomprises a base plate 100, a gate electrode 200 formed on the baseplate 100, a gate insulation layer 300 formed on the substrate 100 andthe gate electrode 200, a poly-silicon layer 400 formed on the gateinsulation layer 300, and a source electrode 500 and a drain electrode600 formed on the gate insulation layer 300 and the poly-silicon layer400. The poly-silicon layer 400 comprises source/drain contact zones 410located at two sides thereof and respectively in engagement with thesource electrode 500 and the drain electrode 600, a channel zone 420located at a center of the poly-silicon layer 400, and lightly dopeddrain (LDD) zones 430 respectively located between the source/draincontact zones 410 and the channel zone 420. In such a process ofmanufacturing the LIPS TFT substrate, the source/drain contact zone 410,the channel zone 420, and the LDD zones 430 need to be doped separatelyand such a manufacturing process needs at least two masks, making theoperation complicated, the manufacturing efficiency low, and themanufacturing cost high.

Thus, it is desired to provide a LTPS TFT substrate and a manufacturingmethod thereof that help overcome the above-discussed problems.

SUMMARY OF THE INVENTION

An object of the present invention is to provide a low temperaturepoly-silicon (LTPS) thin-film transistor (TFT) substrate that comprisesa metal layer arranged on a channel zone so that the electricalresistance of the channel zone is reduced and the TFT on-state currentis relatively high.

Another object of the present invention is to provide a LTPS TFTsubstrate manufacturing method that forms a metal layer on a channelzone and forms lightly-doped drain (LDD) zones in a poly-silicon layerwith the metal layer and a source electrode and a drain electrode as amask so as to save the mask required for separately forming the LDDzones thereby reducing the manufacturing cost and increasing thethroughput.

To achieve the above objects, the present invention provides a LTPS TFTsubstrate, which comprises a base plate, a gate electrode formed on thebase plate, a gate insulation layer formed on the base plate and thegate electrode, a poly-silicon layer formed on the gate insulationlayer, a source electrode and a drain electrode formed on the gateinsulation layer and the poly-silicon layer, and a metal layer formed onthe poly-silicon layer and located between the source electrode and thedrain electrode;

the poly-silicon layer comprising source/drain contact zones located ontwo opposite sides thereof and respectively in engagement with thesource electrode and the drain electrode, a channel zone located underthe metal layer, and LDD zones respectively located between thesource/drain contact zones and the channel zone.

The base plate comprises a glass plate.

The gate insulation layer is formed of a material comprising siliconnitride, silicon oxide, or a combination thereof.

The gate electrode, the source electrode, the drain electrode, and themetal layer are each formed of a material comprising one of molybdenum,aluminum, and copper or a stacked combination of multiple ones thereof.

The source/drain contact zones are N-type heavily-doped zones; thechannel zone is a P-type heavily-doped zone; and the LDD zones areN-type lightly-doped zones; or alternatively, the source/drain contactzones are P-type heavily-doped zones; the channel zone is an N-typeheavily-doped zone; and the LDD zones are N-type lightly-doped zones.

The present invention also provide a LTPS TFT substrate manufacturingmethod, which comprises the following steps:

(1) providing a base plate, depositing a first metal layer on the baseplate, and subjecting the first metal layer to a patterning operation toform a gate electrode;

(2) depositing a gate insulation layer on the base plate and the gateelectrode;

(3) forming a poly-silicon layer on the gate insulation layer;

(4) subjecting two opposite sides of the poly-silicon layer to ionimplantation to form source/drain contact zones; and subjecting acentral area of the poly-silicon layer to ion implantation to form achannel zone;

(5) depositing a second metal layer on the gate insulation layer and thepoly-silicon layer and subjecting the second metal layer to a patterningoperation to form a source electrode, a drain electrode, and a metallayer located between the source electrode and the drain electrode; and

(6) using the metal layer and the source and drain electrodes as a maskto subject the poly-silicon layer to ion implantation so as to form LDDzones located respectively between the source/drain contact zones andthe channel zone.

In step (1), the base plate comprises a glass plate.

In claim 6, wherein in step (2), the gate insulation layer is formed ofa material comprising silicon nitride, silicon oxide, or a combinationthereof.

The gate electrode, the source electrode, the drain electrode, and themetal layer are each formed of a material comprising one of molybdenum,aluminum, and copper or a stacked combination of multiple ones thereof.

The source/drain contact zones are N-type heavily-doped zones; thechannel zone is a P-type heavily-doped zone; and the LDD zones areN-type lightly-doped zones; or alternatively the source/drain contactzones are P-type heavily-doped zones; the channel zone is an N-typeheavily-doped zone; and the LDD zones are N-type lightly-doped zones.

The present invention further provides a LTPS TFT substrate, whichcomprises a base plate, a gate electrode formed on the base plate, agate insulation layer formed on the base plate and the gate electrode, apoly-silicon layer formed on the gate insulation layer, a sourceelectrode and a drain electrode formed on the gate insulation layer andthe poly-silicon layer, and a metal layer formed on the poly-siliconlayer and located between the source electrode and the drain electrode;

the poly-silicon layer comprising source/drain contact zones located ontwo opposite sides thereof and respectively in engagement with thesource electrode and the drain electrode, a channel zone located underthe metal layer, and LDD zones respectively located between thesource/drain contact zones and the channel zone;

wherein the base plate comprises a glass plate;

wherein the gate insulation layer is formed of a material comprisingsilicon nitride, silicon oxide, or a combination thereof;

wherein the gate electrode, the source electrode, the drain electrode,and the metal layer are each formed of a material comprising one ofmolybdenum, aluminum, and copper or a stacked combination of multipleones thereof; and

wherein the source/drain contact zones are N-type heavily-doped zones;the channel zone is a P-type heavily-doped zone; and the LDD zones areN-type lightly-doped zones; or alternatively, the source/drain contactzones are P-type heavily-doped zones; the channel zone is an N-typeheavily-doped zone; and the LDD zones are N-type lightly-doped zones.

The efficacy of the present invention is that the present inventionprovides a LIPS TFT substrate, which comprises a metal layer formed on achannel zone so that the metal layer, a source electrode, and a drainelectrode can be used as a mask to form LDD zones in a poly-siliconlayer in order to save the mask needed for separately forming the LDDzones; further, due to the addition of the metal layer that is connectedto the channel zone of the poly-silicon layer, the electrical resistanceof the channel zone can be effectively reduced to increase a TFTon-state current. The present invention also provides a LTPS TFTsubstrate manufacturing method, in which at the same time of forming asource electrode and a drain electrode, a metal layer is formed on achannel zone and the metal layer, the source electrode, and the drainelectrode are used as a mask to form LDD zones in a poly-silicon layerso as to save the mask needed for separately forming the LDD zonesthereby reducing the manufacturing cost and increasing throughput.

BRIEF DESCRIPTION OF THE DRAWINGS

The technical solution, as well as other beneficial advantages, of thepresent invention will be apparent from the following detaileddescription of embodiments of the present invention, with reference tothe attached drawing. In the drawing:

FIG. 1 is a cross-sectional view showing the structure of a conventionallow temperature poly-silicon (LTPS) thin-film transistor (TFT)substrate;

FIG. 2 is a cross-sectional view illustrating the structure of a LTPSTFT substrate according to the present invention; and

FIG. 3 is a flow chart illustrating a LTPS TFT substrate manufacturingmethod according to the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

To further expound the technical solution adopted in the presentinvention and the advantages thereof, a detailed description is given toa preferred embodiment of the present invention and the attacheddrawings.

Referring to FIG. 2, firstly, the present invention provides a lowtemperature poly-silicon (LTPS) thin-film transistor (TFT) substrate,which comprises a base plate 1, a gate electrode 2 formed on the baseplate 1, a gate insulation layer 3 formed on the base plate 1 and thegate electrode 2, a poly-silicon layer 4 formed on the gate insulationlayer 3, a source electrode 5 and a drain electrode 6 formed on the gateinsulation layer 3 and the poly-silicon layer 4, and a metal layer 7formed on the poly-silicon layer 4 and located between the sourceelectrode 5 and the drain electrode 6.

The poly-silicon layer 4 comprises source/drain contact zones 41 locatedon two opposite sides thereof and respectively in engagement with thesource electrode 5 and the drain electrode 6, a channel zone 42 locatedunder the metal layer 7, and lightly-doped drain (LDD) zones 43respectively located between the source/drain contact zones 41 and thechannel zone 42.

Specifically, the base plate 1 comprises a glass plate.

Specifically, the gate insulation layer 3 is formed of a materialcomprising silicon nitride (SiN_(x)), silicon oxide (SiO_(x)), or acombination thereof.

Specifically, the gate electrode 2, the source electrode 5, the drainelectrode 6, and the metal layer 7 are each formed of a materialcomprising one of molybdenum (Mo), aluminum (Al), and copper (Cu) or astacked combination of multiple ones thereof.

Optionally, the source/drain contact zones 41 are N-type heavily-dopedzones, the channel zone 42 is a P-type heavily-doped zone, and the LDDzones 43 are N-type lightly-doped zones; or alternatively, thesource/drain contact zones 41 are P-type heavily-doped zones, thechannel zone 42 is an N-type heavily-doped zone, and the LDD zones 43are N-type lightly-doped zones.

Preferably, the N-type heavily-doped zones and the N-type lightly-dopedzones are doped with ions that are phosphorous ions or arsenic ions; andthe P-type heavily-doped zones are doped with ions that are boron ionsor gallium ions.

Specifically, the N-type heavily-doped zones or the P-type heavily-dopedzones are doped with ion concentrations with a range of 10¹⁹-10²¹ions/cm³, and the N-type lightly-doped zones are doped with ionconcentrations within a range of 10¹⁶-10¹⁷ ions/cm³.

In the above LIPS TFT substrate, the channel zone is provided, atop,with a metal layer, such that the metal layer and the source electrodeand the drain electrode may serve as a mask to form the LDD zones in thepoly-silicon layer in order to save the mask needed for separatelyforming the LDD zones. Further, due to the addition of the metal layerthat is connected to the channel zone of the poly-silicon layer, theelectrical resistance of the channel zone can be effectively reduced toincrease a TFT on-state current.

Referring to FIG. 3, in combination with FIG. 2, the present inventionalso provides a LIPS TFT substrate manufacturing method, which comprisesthe following steps:

Step 1: providing a base plate 1, depositing a first metal layer on thebase plate 1, and subjecting the first metal layer to a patterningoperation to form a gate electrode 2.

Specifically, in Step 1, the base plate 1 comprises a glass plate.

Step 2: depositing a gate insulation layer 3 on the base plate 1 and thegate electrode 2.

Specifically, in Step 2, the gate insulation layer 3 is formed of amaterial comprising silicon nitride, silicon oxide, or a combinationthereof.

Step 3: forming a poly-silicon layer 4 on the gate insulation layer 3.

Step 4: subjecting two opposite sides of the poly-silicon layer 4 to ionimplantation to form source/drain contact zones 41; and subjecting acentral area of the poly-silicon layer 4 to ion implantation to form achannel zone 42.

Step 5: depositing a second metal layer on the gate insulation layer 3and the poly-silicon layer 4 and subjecting the second metal layer to apatterning operation to form a source electrode 5, a drain electrode 6,and a metal layer 7 located between the source electrode 5 and the drainelectrode 6.

Specifically, the gate electrode 2, the source electrode 5, the drainelectrode 6, and the metal layer 7 are each formed of a materialcomprising one of molybdenum, aluminum, and copper or a stackedcombination of multiple ones thereof.

Step 6: using the metal layer 7 and the source and drain electrodes 5, 6as a mask to subject the poly-silicon layer 4 to ion implantation so asto form LDD zones 43 located respectively between the source/draincontact zones 41 and the channel zone 42.

Optionally, the source/drain contact zones 41 are N-type heavily-dopedzones, the channel zone 42 is a P-type heavily-doped zone, and the LDDzones 43 are N-type lightly-doped zones; or alternatively, thesource/drain contact zones 41 are P-type heavily-doped zones, thechannel zone 42 is an N-type heavily-doped zone, and the LDD zones 43are N-type lightly-doped zones.

Preferably, the N-type heavily-doped zones and the N-type lightly-dopedzones are doped with ions that are phosphorous ions or arsenic ions; andthe P-type heavily-doped zones are doped with ions that are boron ionsor gallium ions.

Specifically, the N-type heavily-doped zones or the P-type heavily-dopedzones are doped with ion concentrations with a range of 10¹⁹-10²¹ions/cm³, and the N-type lightly-doped zones are doped with ionconcentrations within a range of 10¹⁶-10¹⁷ ions/cm³.

In the above-described LTPS TFT substrate manufacturing method, at thesame time of forming a source electrode and a drain electrode, a metallayer is formed on a channel zone and the metal layer, the sourceelectrode, and the drain electrode are used as a mask to form LDD zonesin the poly-silicon layer so as to save the mask needed for separatelyforming the LDD zones thereby reducing the manufacturing cost andincreasing throughput.

In summary, the present invention provides a LTPS TFT substrate, whichcomprises a metal layer formed on a channel zone so that the metallayer, a source electrode, and a drain electrode can be used as a maskto form LDD zones in a poly-silicon layer in order to save the maskneeded for separately forming the LDD zones; further, due to theaddition of the metal layer that is connected to the channel zone of thepoly-silicon layer, the electrical resistance of the channel zone can beeffectively reduced to increase a TFT on-state current. The presentinvention also provides a LTPS TFT substrate manufacturing method, inwhich at the same time of forming a source electrode and a drainelectrode, a metal layer is formed on a channel zone and the metallayer, the source electrode, and the drain electrode are used as a maskto form LDD zones in a poly-silicon layer so as to save the mask neededfor separately forming the LDD zones thereby reducing the manufacturingcost and increasing throughput.

Based on the description given above, those having ordinary skills ofthe art may easily contemplate various changes and modifications of thetechnical solution and technical ideas of the present invention and allthese changes and modifications are considered within the protectionscope of right for the present invention.

What is claimed is:
 1. A low temperature poly-silicon (LTPS) thin-filmtransistor (TFT) substrate, comprising a base plate, a gate electrodeformed on the base plate, a gate insulation layer formed on the baseplate and the gate electrode, a poly-silicon layer formed on the gateinsulation layer, a source electrode and a drain electrode formed on thegate insulation layer and the poly-silicon layer, and a metal layerformed on the poly-silicon layer and located between the sourceelectrode and the drain electrode; the poly-silicon layer comprisingsource/drain contact zones located on two opposite sides thereof andrespectively in engagement with the source electrode and the drainelectrode, a channel zone located under the metal layer, andlightly-doped drain (LDD) zones respectively located between thesource/drain contact zones and the channel zone.
 2. The LIPS TFTsubstrate as claimed in claim 1, wherein the base plate comprises aglass plate.
 3. The LIPS TFT substrate as claimed in claim 1, whereinthe gate insulation layer is formed of a material comprising siliconnitride, silicon oxide, or a combination thereof.
 4. The LTPS TFTsubstrate as claimed in claim 1, wherein the gate electrode, the sourceelectrode, the drain electrode, and the metal layer are each formed of amaterial comprising one of molybdenum, aluminum, and copper or a stackedcombination of multiple ones thereof.
 5. The LIPS TFT substrate asclaimed in claim 1, wherein the source/drain contact zones are N-typeheavily-doped zones; the channel zone is a P-type heavily-doped zone;and the LDD zones are N-type lightly-doped zones; or alternatively, thesource/drain contact zones are P-type heavily-doped zones; the channelzone is an N-type heavily-doped zone; and the LDD zones are N-typelightly-doped zones.
 6. A low temperature poly-silicon (LTPS) thin-filmtransistor (TFT) substrate, comprising a base plate, a gate electrodeformed on the base plate, a gate insulation layer formed on the baseplate and the gate electrode, a poly-silicon layer formed on the gateinsulation layer, a source electrode and a drain electrode formed on thegate insulation layer and the poly-silicon layer, and a metal layerformed on the poly-silicon layer and located between the sourceelectrode and the drain electrode; the poly-silicon layer comprisingsource/drain contact zones located on two opposite sides thereof andrespectively in engagement with the source electrode and the drainelectrode, a channel zone located under the metal layer, andlightly-doped drain (LDD) zones respectively located between thesource/drain contact zones and the channel zone; wherein the base platecomprises a glass plate; wherein the gate insulation layer is formed ofa material comprising silicon nitride, silicon oxide, or a combinationthereof; wherein the gate electrode, the source electrode, the drainelectrode, and the metal layer are each formed of a material comprisingone of molybdenum, aluminum, and copper or a stacked combination ofmultiple ones thereof; and wherein the source/drain contact zones areN-type heavily-doped zones; the channel zone is a P-type heavily-dopedzone; and the LDD zones are N-type lightly-doped zones; oralternatively, the source/drain contact zones are P-type heavily-dopedzones; the channel zone is an N-type heavily-doped zone; and the LDDzones are N-type lightly-doped zones.